Design Optimization of Multi Vacuum Manifold for Semiconductor Industry
DOI:
https://doi.org/10.53912/iejm.v1i1.128Abstract
This paper presents the design optimization of multi vacuum manifold in gripping system for semiconductor industry. The objectives of this study were to investigate the parameter of designing manifold in vacuum system and analyze the results base on simulation software. The study was focused on the air flow in manifold system. The pressure drop, type of flow involved, and improper design were the factors that influenced the flow efficiency in manifold system. The study of multi vacuum manifold was carried out the design parameters involved such as various sizes of inlet, number of inlet used and the distance between the inlets used. The simulation was performed using CAD software to present the dynamic pressure and mass flow rates. Based on the simulation result, the design with the total cross section area inlets is less or equal to out resulted better value of velocity and suction pressure distributed in each inlet. In addition, the longer distance travels by fluid from inlet to outlet affects the result obtained. In conclusion, the new design of multi vacuum manifold for semiconductor industry was proposed.
Downloads
Published
Issue
Section
License
Copyright
Authors published in this journal agree to the following terms:
1. The copyright of each article is retained by the author (s).
2. The author grants the journal the first publication rights with the work simultaneously licensed under the Creative Commons Attribution License, allowing others to share the work with an acknowledgment of authorship and the initial publication in this journal.
3. Authors may enter into separate additional contractual agreements for the non-exclusive distribution of published journal versions of the work (for example, posting them to institutional repositories or publishing them in a book), with acknowledgment of their initial publication in this journal.
4. Authors are permitted and encouraged to post their work online (For example in the Institutional Repository or on their website) before and during the submission process, as this can lead to productive exchanges, as well as earlier and larger citations of published work.
5. Articles and all related material published are distributed under a Creative Commons Attribution-ShareAlike 4.0 International License.
License
Industrial Engineering Journal is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License
You are free to :
Share — copy and redistribute the material in any medium or format
Adapt — remix, transform, and build upon the material for any purpose, even commercially
Under the following terms :
Attribution — You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
ShareAlike — If you remix, transform, or build upon the material, you must distribute your contributions under the same license as the original
No additional restrictions — You may not apply legal terms or technological measures that legally restrict others from doing anything the license permits
